K. Mathwig, M. Geilhufe, F. Müller and U. Gösele
Bias-assisted KOH etching of macroporous silicon membranes
Journal of Micromechanics and Microengineering 21 (2011) 035015.
→ IOP select
→ Highlights of 2011 selection
This paper presents an improved technique to fabricate porous membranes from macroporous silicon as a starting material. A crucial step in the fabrication process is the dissolution of silicon from the backside of the porous wafer by aqueous hydroxide to open up the pores. We improved this step by biasing the silicon wafer electrically against the KOH. By monitoring the current–time characteristics a good control of the process is achieved and the yield is improved. Also, the etching can be stopped instantaneously and automatically by short-circuiting Si and KOH. Moreover, the bias-assisted etching allows for the controlled fabrication of silicon dioxide tube arrays when the silicon pore walls are oxidized and inverted pores are released.